Long-running vacancy
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- Work model
- Office
- Experience
- 5+ years
- Employment
- Not specified
- Compensation
- Not disclosed
- Technology signal
- Not parsed
Full listing
Role description
For our site in Holon, we are looking for a Thermal and Flow Analysis Engineer to join a multidisciplinary team developing advanced electronic packaging solutions in a dynamic and innovative environment
In this role you will
Perform thermal and flow analyses for electronic packaging systems
Work in accordance with aerospace standards and environmental conditions such as MIL-STD810
Lead and manage projects from thermal and structural aspects
Participate in and support thermal and dynamic environmental laboratory tests
Manage and guide subcontractors in analysis and design activities
Requirements
B.Sc. in Mechanical Engineering
At least 5 years of experience in analysis engineering
Experience in thermal and dynamic testing
Knowledge in material and coating selection - Advantage
Knowledge in static and dynamic structural calculations - Advantage
High level of English
Team player with creative thinking and ability to work flexible hours when needed
*Only relevant applications will be answered
#Holon